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Chip module bonding a wotumi de ho to so .
Ɛfata ma PVC, ABS, PET, ne PC Kaad .
Processability pa wɔ injection lines a wɔtaa de di dwuma nyinaa so .
Mpanyinyɛ ho ɔsɔretia a eye kyɛn so .
Rɔba a ɛwɔ mu a ɛkorɔn, a ɛma ɛyɛ nea ɛyɛ mmerɛw sɛ ɛbɛdannan ne ho daa .
ABISADEƐ
Tesa HAF 8410 HS no yɛ nea wɔayɛ no pɔtee ama chip module ahorow a wɔde bɛhyɛ smart cards mu. Ɛfata nso sɛ ɛde ɔhyew nyinaa-nneɛma a ɛko tia te sɛ dade, ahwehwɛ, plastic, nnua, ne ntama, sɛ nhwɛso no, clutch friction linings.
Wɔasom nnwuma ahorow .
- IC chip a ɛhyɛ PVC, PET, anaa Smart Cards a wɔabom ayɛ mu .
- Smart card a wɔyɛ ma sikakorabea, ID, ne akwan a wɔfa so kɔ hɔ .
- Secure card lamination ne nhyiam .
- Ɔhyew bonding a ɛwɔ microelectronics mu wɔ card applications mu .
- High-Precision Electronics Assembly a ɛho hia sɛ wɔde ɔhyew yɛ adwuma .
Tags a ɛyɛ hyew .: TESA HAF 8410 HS Heat-Activated Film – High Precision Thermal Film ma IC a wɔde hyɛ Smart Cards mu, China TESA HAF 8410 HS Ɔhyew-Activated Film – High Precision Thermal Film for IC Embedding in Smart Cards Manufacturers, Suppliers, Factory
