
Su
- Ɔhyew a ɛkorɔn a ɛko tia (-269 digrii kosi +260 digrii ) .
- Electrical insulation ne mfiri ahoɔden a ɛda nsow
- Kɔbere layer ma conductivity a ɛkyɛn so ne EMI shielding
- High flexibility a ɛfata ma flexible circuit dwumadie
- Uniform thickness hwɛ hu sɛ stable bonding ne lamination
- Nnuru a ɛko tia yiye ne onyin a ɛtra hɔ kyɛ
Abisadeɛ:
Wɔde Copper Clad Polyimide Film 0.05 di dwuma kɛse wɔ flexible printed circuits (FPC), anyinam ahoɔden a ɛyɛ hyew a ɛkorɔn-, lithium battery packaging, ahunmu ɛlɛtrɔnik, EMI shielding, ne kar ɛlɛtrɔnik.

Nnwumakuw a Wɔsom
1.Flexible Printed Circuit (FPC) adwumayɛ
01
2.High-temperature anyinam ahoɔden insulation ne ahobammɔ
02
3.Lithium batere a wɔde ahyɛ mu ne insulation layers
03
4.Aerospace ɛlɛtrɔnik nneɛma
04
5.EMI kyɛm dwumadie
05
6.Automotive ɛlɛtrɔnik mfiri
06
7.High-frequency nkitahodi mfiri
07
8.Insulation wɔ tumi ne ahoɔden nhyehyɛe
08
Akadeɛ




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