Wɔayɛ temperature tapes a ɛkorɔn-temperature tapes no sɛnea ɛbɛyɛ a ebetumi agyina mmeae a ɛyɛ hu ano na akura adwumayɛ a wotumi de ho to so ase wɔ ɔhyew ase. a egyina .Base material .neabisadeɛ, wobetumi akyekyɛ mu ayɛ no akuw a edidi so yi:
1. PE tape .
Ɔhyew a ɛwɔ hɔ:-30℃kosi 100℃.
Ɛyɛ papa ma nneɛma a ɛyɛ mmerɛw, sini, plastic ntama, ne ahwehwɛ nneɛma.
2. PVC tape .
Ɔhyew a ɛwɔ hɔ:-50℃kɔ 120℃.
Wɔde di dwuma ma hardware ne anyinam ahoɔden a wɔde bɔ ho ban, na esiw oxidation ano.
3. pp tap .e
Ɔhyew a ɛwɔ hɔ:-30℃kɔ 150℃.
Ɛfata ma composite panels, dade ahwehwɛ, ne plastic nneɛma.
4. Polyimide teapɔn (PI / Kapton) .
Ɔhyew a ɛwɔ hɔ:-269℃kosi 400℃.
insulation a ɛkyɛn so; Wɔde di dwuma ma circuit board soldering, ɛlɛtrɔnik nneɛma a wɔde siw ano, ne chip a wɔde kyekyere nneɛma ho.
5. PTFE tape (Teflon teapɔn) .
Ɔhyew a ɛko tia: .Ɛkɔsi 260℃.
non{0}}aduru ne nnuru-a ɛko tia; Ɛyɛ papa ma ɔhyew-mfiri mfiri, rola a wɔde kyekyere nneɛma ho, aduan a wɔde hohoro nneɛma, ne anti-nsu a ɛyɛ hyew.
6. Pet a ɛkorɔn-teɛtɛw teapɔn .
Ɔhyew a ɛko tia: .Ɛkɔsi 200℃.
gyaw nkae biara bere a wɔayi afi hɔ no; Wɔde di dwuma ma PCB solder masking, chassis coating ahobammɔ, LED potting, ne electroplating masking.
7. Ɔsoro-Ɔhyew a wɔde kata so (Crepe Paper Tape) .
Ɔhyew a ɛwɔ hɔ:120℃–180℃.
Ɛnyɛ den sɛ wobɛtetew; Wɔde di dwuma de yɛ mfonini, dansi a wɔde wie, ne plastic a wɔde petepete so ho banbɔ.
8. Glass fiber tape .
Ɔhyew a ɛko tia: .300℃ne nea ɛboro saa .
ahoɔden a ɛkorɔn ne ɔbrɛ a ɛko tia; Wɔde di dwuma ma motor coil wrapping, ɛkorɔn-temperature sealing, ne ogya ntama a wɔde hyɛ mu den.
9. Aluminium foil tape .
Ɔhyew a ɛkɔ so yiye, ogyaframa a ɛmma ogya ntumi nkɔ mu, ne EMI a ɛbɔ ho ban.
Ɛyɛ papa ma kar mu mframa a wɔde fi adi, HVAC duct sealing, ne aerospace insulation .
10. Ɔsoro-Ɔhyew a ɛbɔ ho abien-afã teapɔn .
Ɔhyew a ɛwɔ hɔ:150℃–230℃.
adhesion a emu yɛ den; Wɔde di dwuma ma bonding glass panels, kar din nkrataa, ne LED strip installation.
11. Silicone rɔba teapɔn .
Ɔhyew a ɛko tia: .Ɛkɔsi 250℃.
a ɛyɛ mmerɛw, ɛyɛ onyin-ɛko tia, na ɛyɛ den; Wɔde di dwuma kɛse wɔ ahoɔden foforo battery bundling, thermal management, ne soro-temperature sealing.
Nea ɛfata a wobɛpaw .Ɔsoro-teaseɛnam .Egyina wo nneɛma a woyɛ no ahiade ne wo adwumayɛbea so. Sɛ wopaw base material a ɛfata a, ɛma adwumayɛ gyina, ɛka a wɔbɔ, ne bere tenten-bere mu ahotoso.
