3M sɛ wɔbɛda Semiconductor Chip Adhesive Ano Aduru adi
Wɔsii so dua wɔ 2026 (3rd) Semiconductor, Sensor & Emerging High-End Electronics Adhesive Innovation Forum no mu
Bere a China semiconductor, sensor, ne ɛlɛtrɔnik mfiridwuma a ɛwɔ soro-a ɛreba no kɔ so kɔ sonkabom a ɛkorɔn, miniaturization, ne adwumayɛ density, nneɛma a wɔde nkata ade so abɛyɛ ade titiriw a ɛma wotumi yɛ ɛlɛtrɔnik mfiri a ɛkɔ akyiri. Firichip nhyiam ne thinning to thermal management, seesei bonding solutions di dwuma titiriw wɔ product ahotoso, aba, ne bere tenten-bere a ɛyɛ den mu.
Wɔ saa tebea yi mu no,...2026 (3rd) Semiconductor, Sensor & Emerging High-Awiei Ɛlektrɔnik Adhesive Nneɛma Foforo Nhyiamwɔbɛkura muƆberɛfɛw da 7–8, afe 2026, wɔ Shenzhen, China. Wɔbom yɛ nhyiam no ho nhyehyɛe denam...STK Teyp a wɔde yɛ adwuma, noNneɛma Foforo Nnwumayɛkuw Apam, ne neaShenzhen Nyansafo Sensor Nnwuma Fekuw, ne afoforo.
Sɛ yɛde nkyerɛaseɛ a ɛdi mu a wɔyɛeɛ wɔ afe 2023 ne 2024 mu no si so, afe yi nhyiamu no botaeɛ ne sɛ ɛde bɛmain-nhumu a emu dɔ wɔ gua so nsɛm, dwumadie nsɛnnennen, ne mfiridwuma mu nkɔsoɔwɔ ɛlɛtrɔnik adhesive nneɛma a ɛkorɔn-awieɛ mu, a ɛboa China ɛlɛtrɔnik abɔdeɛ a nkwa wom a ɛkɔ anim no nkɔsoɔ a ɛkorɔn-.
Wiase Nyinaa Adhesive Leader 3M a ɔde Keynote Presentation bɛma
"3M Adhesive Ano aduru a Wɔde Yɛ Semiconductor Chips".
Ɛyɛ wɔn a wɔyɛ nhyiam no ho nhyehyɛe no nidi sɛ wɔma wɔn akwaaba3M China Adwumakuw, Ltd., wiase nyinaa kannifo wɔ mfiridwuma a wɔde nkata ade ne nea ɛyɛ adwuma mu, sɛ obi a ɔde ne ho hyɛɛ dwumadi no mu titiriw.
Oduruyɛfo Liu Wei na ɔkyerɛwee,
Guadiɛ Nkɔsoɔ sohwɛfoɔ panin, Greater China, 3M China,
wɔato nsa afrɛ no sɛ ɔmfa mfiridwuma ho ɔkasa titiriw bi a wɔato din:
"3M Adhesive Ano aduru a Wɔde Yɛ Semiconductor Chips".
Ɔkasafo Ho Nsɛm|Oduruyɛfo Liu Wei na ɔkyerɛwee
Mfeɛ 19 osuahu wɔ 3M
Guadibea Nkɔso sohwɛfo Panyin, Greater China (mfe 6) .
Tape & Adhesive Mfiridwuma ho Ɔbenfo Panyin a ɔhwɛ Asia-Pacific (mfe 14)
Osuahu a ɛtrɛw wɔnneɛma a wɔyɛ, nhyehyɛe a wɔyɛ, scale-up manufacturing, ne application engineering
Wogye Oduruyɛfo Liu tom kɛse sɛ otumi hu nnipanneɛma a ɛreba wɔ ɛlɛtrɔnik mfiri ho gua sona wɔkyerɛ nneɛma ho mfiridwuma a ɛkɔ anim ase kɔmfaso, nhyehyɛe-level bonding ano aduruwɔ ɛlɛtrɔnik nhyiam bo a ɛsom no nyinaa so. Ɔkɔ so de mfiridwuma mu nkɔso a aba foforo no bom yɛ adhesive akwan a wotumi de di dwuma ma semiconductor ne high-end electronic applications.
Nsɛmti Titiriw a Wɔde Kyerɛkyerɛ
Oduruyɛfo Liu nkyerɛkyerɛmu no bɛtwe adwene asi mfiridwuma a wɔde nkata so a ɛboa semiconductor packaging a ɛkɔ anim ne kɔmputa dwumadie a ɛyɛ adwuma yie-a, a nea ɛka ho ne:
Nneɛma a wɔde nkata so ma Semiconductor Chip Nhyiam
Nsɛnnennen atitiriw a ɛwɔ bonding mu wɔ chip, wafer, ne package-level nhyiam mu
High-reliability adhesive ano aduru ma pɛpɛɛpɛ ɛlɛtrɔnik adwumayɛ
Adhesives ma Chip Thinning ne Bere Tiaa mu Bonding Nneɛma
Nneɛma ano aduru a wɔde yɛ thinning, fixation, ne debonding akwan
Ntu mpɔn wɔ aba ne nhyehyɛe a ɛyɛ den wɔ semiconductor a ɛkɔ anim mu
Ɔhyew Ho Nsiesiei Adhesive Ano Aduru ma High-Adwumayɛ Chips
Adhesive ne bonding nneɛma ma AI ne high-computing-power chips
Kari pɛ a ɛkari pɛ wɔ ɔhyew a ɛkɔ soro, nhyɛso a ɛba fam, ne bere tenten-bere mu ahotoso
Bɛyɛ 3M China
Wɔde sii hɔ wɔ1984, 3M China Adwumakuw, Ltd.yɛ nnwumakuw kakraa bi a wotumi de ma wɔ wiase nyinaa no mu biakoano aduru a wɔaka abom a ɛkata teyp, ade a wɔde nkata so, ne nneɛma a wɔde nkata so a wɔde yɛ nneɛma a wɔde di dwuma wɔ ɔkwan a ɛyɛ adwuma so.
3M a ɛwɔ China no bi ne:
9 mmeae a wɔyɛ nneɛma
baa dwumadibea ahorow 20
Mfiridwuma ho mmeae 4 ne R&D beae 1
Ɛkaa dɛadwumayɛfo 8,000 na wɔwɔ hɔ
Wɔde sii hɔ wɔ1902 mu wɔ United States, 3M yɛ wiase nyinaa mfiridwuma adwumakuw a ɛyɛ ahorow ahorow na ɛyɛ gyinapɛn wɔ nneɛma a wɔde yɛ adwuma foforo mu.
FY2024 wiase nyinaa sika a wonyae:USD ɔpepepem 24.575
FY2024 mfasoɔ a wɔnyaeɛ:USD ɔpepepem 4.009
Jan–Sep 2025 adwumayɛ:
Sika a wonyae: RMB ɔpepepem 18.815
Mfaso a wonyae: USD ɔpepepem 2.673
Nnwuma mu Nsɛnnennen a Wobedi Ho Dwuma ne Ɛlektrɔnik Nneɛma a Wɔde Ntama Nneɛma Daakye a Wɔbɛhyehyɛ
2026 forum no bɛka ho asɛm tẽẽ wɔ...gua so ahwehwɛde a aba foforo ne mfiridwuma mu nsɛnnennenwɔ semiconductor, sensor, robotics, ne ɛlɛtrɔnik dwumadie foforɔ a ɛrepue a ɛkorɔn-awieɛ mu. Ɛbɛtwe adwene asi...ɛyaw atitiriw, hokwan ahorow a wɔde yɛ nneɛma foforo, ne tebea horow a wɔde di dwumasɛ nnwumakuw a wɔyɛ nneɛma a wɔde nkata ade so no dwen ho kɛse.
Sɛ́ obi a ɔyɛ adwumaden a ɔde adhesive tape ano aduru ma a ɔsom ɛlɛtrɔnik ne mfiridwuma mu adetɔfo wɔ wiase nyinaa no, .STK Teyp a wɔde yɛ adwumakɔ so di wiase nyinaa mfiridwuma akannifo te sɛ 3M akyi yiye. Ɛdenam nneɛma foforo a ɛyɛ nwonwa a wɔkyerɛ ase kɔmfasoɔ, dwumadie-driven bonding ano aduru, STK Tape ahyɛ bɔ sɛ ɛbɛboa awo ntoatoaso a edi hɔ a ɛyɛ ɛlɛtrɔnik adwumayɛ a ɛkorɔn-awie.
Adeyɛ no ho nsɛm a ɛkɔ akyiri
�� Da:Ɔberɛfɛw da 7–8, afe 2026
�� Beaeɛ:Shenzhen, China, na ɛwɔ hɔ
�� Dwumadie:2026 (3rd) Semiconductor, Sensor & Emerging High-Awiei Ɛlektrɔnik Adhesive Nneɛma Foforo Nhyiam
