Nhwehwɛmu kuw bi a Prof.Huang Xingyi .neƆbenfo Shi Kunming .firiShanghai Jiao Tong Sukuupɔn .ayɛ a .Multilayer thermally conductive ne anyinam ahoɔden a ɛbɔ ho ban (MTCEIT) .. Saa ade foforo yi ma wotumi tew CPU hyew so kodu .9℃., a ɛde ano aduru foforo ma ɔhyew a wɔsɛe no wɔ ɛlɛtrɔnik mfiri a ɛyɛ den mu.
MTCEIT nhyehyɛe no sandwiches .Graphene krataa .(High thermal conductivity core) wɔ ntam .BNNS{0}}PBCOEA NKYERƐKYERƐMU A ƐYƐ MMƆBƆ ., a wɔde ka ho .Silicone rɔba (SR) akyigyina .ahyɛ mu ma .Boron nitride a ɛwɔ afã horow (h{0}}BN) .Nneɛma a ɛyɛ mmerɛw. wɔ ne kɛse bɛyɛ .300 μm, teapɔn no nya .Wɔ-plane ɔhyew a ɛkɔ mu yɛ 121.22 w/m·k ., a Volume resistivity a ɛyɛ 5.07×1011 Ω·cm ., ne a .Weibull su a ɛyɛ den a ɛyɛ 36.9 kV/mm ..
Wɔ ankasa-Wiase sɔhwɛ ahorow mu no, MTCEIT tew .CPU hyew a ɛyɛ laptop a ɛyɛ tratraa no yɛ digrii 9 .na ɛma ɛyɛ den .Video frame rate nsakrae wɔ nea ennu anaasɛ ɛne 0.1 fps yɛ pɛ mu .Wɔ Ultra-shwimbran ahorow a ɛyɛ teateaa mu a enni onwini a ɛyɛ nnam.
Adesua no, a wɔato din ."Graphene krataa-gyina so multilayer thermally conductive tapes a ɛwɔ anyinam ahoɔden a ɛyɛ soronko a ɛma ɔhyew a ɛkɔ soro dissipation," .wotintimii wɔ .Nneɛma a wɔde yɛ adwuma a ɛkɔ akyiri (AFM) ..
Mfonini 1. MTCEIT no nhyehyeɛ.
(a) Nhyehyeɛ ho mfonini a ɛkyerɛ ɔhyew a wɔsɛe no nhyehyɛe wɔ ɛlɛtrɔnik mfiri a ɛyɛ den a ɛka MTCEIT ho.
(b) Ɔhyew a ɛwɔ soro no kyekyɛ a ɛwɔ teapɔn a ɛwɔ nhyehyɛe ahorow wɔ steady-tebea tebea ase wɔ finite element simulations mu.
(C–E) Ɔhyew fibea no hyew a ɛkari pɛ kɛse wɔ finite element simulations no mu sɛ (c) layer no mu duru ratio, (d) IN{0}}plane (κ//) no ne denam{1}}plane (κ⊥) ɔhyew kwan a ɛkɔ so wɔ adhesive layers no mu, ne (E) a ɛwɔ ntam no/ Adhesive layer ne akyi fã no .
Mfonini 2. MTCEIT no nhyehyeɛ ne ne mfiridwuma.
(a) MTCEIT ne aguadi graphene krataa no ho mfonini a ɛwɔ aniwa so.
(b) Cross-afã ne (c) interlayer compact contact SEM mfonini ahorow a ɛwɔ MTCEIT no mu.
(d) EDS spectrum ne (e) XRD nhyehy e a εfa MTCEIT ho.
(f) bending ne (g) MTCEIT tebea horow a wɔhyehyɛ.
(h) Tensile stress–strain curve a ɛwɔ MTCEIT no mu.
Mfonini 3. Thermal conductivity ne anyinam ahoɔden a ɛbɔ MTCEITs no ho ban.
Mfonini 4. Ɔhyew a ɛma laptop a ɛyɛ teateaa no sɛe.
(a) Laptop motherboard no ho mfonini a ɛwɔ aniwa so. MTCEIT no kɛse yɛ 130 mm × 60 mm.
(b) Schematic illustration a ɛkyerɛ CPU ɔhyew a ɛma ɛyɛ mmerɛw no nhyehyɛe a wɔayɛ no mmerɛw no.
(c) Infrared thermal mfonini a ɛwɔ laptop no mu.
(d) ɔhyew mu nsakrae ne (e) CPU hyew wɔ 1200 s. Inset a ɛwɔ (d) mu no kyerɛ optical image a ɛwɔ laptop a wɔasɔ ahwɛ no mu.
Wɔyɛɛ sɔhwɛ ahorow no nyinaa wɔ adwumayɛ tebea a ɛfata mu. Wɔsusuu ɔhyew no denam-wɔ CPU sensor a wɔasisi no so na wɔde AIDA64 Extreme software hwɛɛ so.
Mfonini 5. Ɔhyew a wɔsɛe no wɔ ultra-Smartphone a ɛyɛ teateaa a enni onwini a ɛyɛ adwuma.
