TESA® 4959 yɛ premium double-sided translucent non-woven tape a ɛwɔ 100μm thick carrier a ɛwɔ high-performance acrylic adhesive wɔ afã abien no nyinaa. Saa adansi titiriw yi ma ahoɔden a ɛkyɛn so bonding bere a ɛkura translucency mu, na ɛma ɛyɛ nea eye ma mfiridwuma nhyiam dwumadi ahorow a nea ɛka ho ne mounting, splicing, ne bonding wɔ baabi a ahoɔden ne adwempa nyinaa ho hia.
Su
- Premium Acrylic Adhesive: Ɛma nkitahodi a emu yɛ den na ɛtra hɔ daa wɔ nneɛma ahorow so
- 100μm Thin Construction: Ma kwan ma discrete bonding wɔ pɛpɛɛpɛ applications
- Translucent Non-Woven Carrier: Ɛkura anifere kwan so bere a ɛde ahoɔden a ɛkyɛn so ma
- Excellent Temperature Resistance: Ɛyɛ adwuma a wotumi de ho to so wɔ ɔhyew a ɛtrɛw mu
- High Tensile Strength: Durable carrier gyina nhyɛso kɛse ne sɛnea wodi ho dwuma
- Nea ɛne ne ho hyia yiye: Ɛdannan ne ho yiye wɔ nneɛma a ɛnyɛ pɛpɛɛpɛ kakra ho
- Nkwakoraa ne mmerewa a ɛko tia: Ɛma nneɛma a ɛbata ho ne sɛnea ɛte no kɔ so bere tenten
TDS na ɛwɔ hɔ
Nnwuma a Wɔde Di Dwuma
TESA® 4959 double-sided translucent non-woven tape no de adwumayɛ soronko ma wɔ mfiridwuma nhyiamu dwumadie mu baabi a ahoɔden ne aniwa mu adwempa nyinaa ho hia. 100μm teateaa adansi a wɔaka abom ne premium acrylic adhesive hwɛ hu sɛ ahotoso bonding a ensɛe profile anaa hwɛbea. Wɔ B2B afɛfoɔ ne adwinnan ahokafoɔ fam no, yɛde customization options a ɛkɔ akyiri a precision die-cutting, custom widths, ne specialized adhesive formulations ka ho ma de di adwumayɛ ahwehwɛdeɛ pɔtee ho dwuma. Yɛn mfiridwuma kuw no de animdefo mmoa ma wɔ application optimization ne automated integration ho, hwɛ hu sɛ wɔde bedi dwuma a ɛnyɛ den wɔ wo manufacturing nhyehyɛe ahorow mu bere a wokura gyinapɛn a ɛkorɔn sen biara mu.
Nnwuma a Wɔyɛ Ɔsom
Pɛpɛɛpɛɛ Mounting
Edin nkrataa, nkyerɛwde, ne nneɛma a wɔde siesie fie a wɔde anifere hyehyɛ
Industrial Splicing a Wɔde Yɛ Nneɛma
High-adwumayɛ splicing applications wɔ adwinnan nhyehyɛe mu
Mfonini a Wɔde Yɛ Mfonini
Nneɛma a wɔde kyerɛ, nsɛnkyerɛnne, ne nneɛma a wotumi hu a wɔde besisi baabi a sɛnea ɛte ho hia
Ɛlektrɔnik Nneɛma Nhyiam
Component mounting ne nhyiam wɔ ɛlɛtrɔnik mfiri mu
Kar Ho Nneɛma a Wɔde Di Dwuma
Bonding mu trim ne nneɛma a ɛhwehwɛ sɛ discrete adhesion
Nneɛma a Wɔde Kyerɛkyerɛ
Nneɛma a wɔde kyerɛ ne nneɛma a wɔde kyerɛ a wɔboaboa ano a ɛhwehwɛ sɛ wɔde nkitahodi a emu yɛ den a aniwa nhu di dwuma
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