Single-Ɔfã Conductive Kɔbere Foil Teapɔn ma EMI / RFI Shielding - STK
STK's Single-Side Conductive Copper Foil Tape is a premium electronic-grade material designed to solve complex electromagnetic compatibility (EMC) and grounding challenges. It is engineered using a high-purity copper foil backing (>99.95%) a wɔde acrylic adhesive matrix a ɛkɔ anim, a wɔde nnuru abɔ mu a ɛwɔ conductive micro-particles a wɔapete pɛpɛɛpɛ wom akata so.
Nea ɛnte sɛ kɔbere foils a wɔde siesie nneɛma a wɔahyɛ da ayɛ no, saa mfiridwuma-grade teyp yi ma ɔkwan soronko a wɔfa so de nneɛma kɔ baabiara-fã biako. Wei kyerɛ sɛ kɔbere akyi no yɛ conductive koraa wɔ ne soro (X ne Y axes), bere a advanced adhesive layer nso de vertical conductivity a ɛkyɛn so (Z-axis continuity) ma. Sɛ wɔde di dwuma wɔ ɛlɛtrɔnik substrate so a, ɛde anyinam ahoɔden nkitahodi a ɛba ntɛm ara na wotumi de ho to so si hɔ denam bond line no so, na ɛma ɛyɛ ade titiriw ma EMI/RFI shielding dwumadie wɔ ɛlɛtrɔnik mu.
Mfiridwuma Ho Nsɛm a Wɔakyerɛkyerɛ Mu
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Aguade no Edin |
Kɔbere Foil Teyp a Ɛma Nsu |
Kɔbere Foil Teyp a Ɛma Nsu |
Kɔbere Foil Teyp a Ɛma Nsu |
Kɔbere Foil Teyp a Ɛma Nsu |
Kɔbere Foil Teyp a Ɛma Nsu |
Kɔbere Foil Teyp a Ɛma Nsu |
Tin-Plating kɔbere foil teapɔn |
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Backing |
Kɔbere krataa/ Nano Carbon kɔbere krataa |
Kɔbere krataa/ Nano Carbon kɔbere krataa |
Kɔbere krataa/ Nano Carbon kɔbere krataa |
Kɔbere krataa/ Nano Carbon kɔbere krataa |
Kɔbere krataa/ Nano Carbon kɔbere krataa |
Kɔbere krataa/ Nano Carbon kɔbere krataa |
Kɔbere a wɔde ayɛ krataa |
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TotalThickness a Ɛyɛ Fɛ |
0.02 |
0.03 |
0.05 |
0.06 |
0.07 |
0.09 |
0.12 |
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Kɔbere foil Thickness(mm) . |
0.009 |
0.009 |
0.018 |
0.025 |
0.035 |
0.05 |
0.045 |
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Peel Adhesion a Ɛbata Ho |
1.2 |
1.2 |
1.2 |
1.2 |
1.2 |
1.2 |
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Ɔfa so Nkonimdi(Ω) |
Ennu anaasɛ ɛne 0.05 yɛ pɛ |
Ennu anaasɛ ɛne 0.05 yɛ pɛ |
Ennu anaasɛ ɛne 0.05 yɛ pɛ |
Ennu anaasɛ ɛne 0.05 yɛ pɛ |
Ennu anaasɛ ɛne 0.05 yɛ pɛ |
Ennu anaasɛ ɛne 0.05 yɛ pɛ |
Ennu anaasɛ ɛne 0.03 yɛ pɛ |
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Tumi a wokura mu |
48 |
48 |
48 |
48 |
48 |
48 |
48 |
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Bere tiaa-bere mu ɔhyew( anoɔden ) |
120 |
120 |
120 |
120 |
120 |
120 |
250 |
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Bere tenten-ɔhyew( anoɔden ) |
80 |
80 |
80 |
80 |
80 |
80 |
220 |
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Hyɛ no nsow |
Single ɔfã conductive ne abien ɔfã conductive sɛnea wopɛ |
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EMI/RFI Shielding & Grounding a ɛkɔ akyiri ma High-Density Electronics
Bere a ɛlɛtrɔnik nhyiam ahorow no reyɛ ketewaa na ɛyɛ kɛse-frequency no, dede a ɛwɔ mu a wɔbrɛ ase no bɛyɛ mfiridwuma mu anohyeto titiriw. STK Conductive Copper Tape no de n’ani si saa mmerɛwyɛ ahorow yi so pɛpɛɛpɛ:
EMI/RFI Shielding a ɛnyɛ nea ɛyɛ den
Kɔbere akyi a ɛyɛ den, a ɛho tew kɛse-yɛ adwuma sɛ Faraday afiri a eye kyɛn so, ɛda mframa mu anyinam ahoɔden asorɔkye (EMI) ne radio frequency interference (RFI) adi na ɛtwetwe wɔ frequency kwan a ɛyɛ 30 MHz kosi 1 GHz so.
Static Dissipation & Grounding a Wotumi De Ho To So
Ntɛm ara yi static charges a wɔaboaboa ano no na ɛma kwan a ɛba fam-resistance a ɛkɔ fam ma delicate printed circuit boards (PCBs) ne flexible circuits (FPCs).
Kyerɛw Component Integration
Ɛyɛ papa sɛ wɔde ɛlɛtrɔnik mfiri a ɛwɔ mu no bɛto fam na wɔabɔ ho ban wɔ PAD, PDP, LCD screens, ne laptops mu, a ɛtew draiver a ɛyɛ mmerɛw fi radio nsɛnkyerɛnne a atwa yɛn ho ahyia ho.
Conformability a ɛkyɛn so
Kɔbere a ɛyɛ mmerɛw a awu{0}}dannan ne ho yiye wɔ anim a ɛyɛ den, nsusuwso, ne dade adan a ɛyɛ den mu a ɛnpaapae anaasɛ ɛnma so nkɔ akyirikyiri wɔ anoano.
Nneɛma foforo / Ntotoho
Nneɛma a Wɔde Sisi Nneɛma a Wɔde Di Dwuma Wɔ Brand
Nea ɛne: 3M 1181 Kɔbere Foil Shielding Tape yɛ pɛ
Wɔde toto: tesa conductive kɔbere foil tape
Wɔde toto: Nitto EMI kɔbere teyp a ɛbɔ ho ban
Nteaseɛ a Wɔde Toto Ho
Saa ara na kɔbere foil akyi a conductive adhesive nhyehyɛe
Wɔayɛ ama EMI shielding, grounding, ne static discharge dwumadie
Saa ara conductivity ne shielding etu mpɔn adwumayɛ
Ka-Akwan foforo a Etu mpɔn
Factory tẽẽ kɔbere foil tapes ma:
Ɛka a wɔkora so bɛyɛ 30%–60% .
Amanneɛbɔ ntrɛwmu, tenten, ne die-twitwa formats
Nkwammoaa a ɛma nsuo ne nea ɛnyɛ -nsuo a ɛma nsuo fa nkatasoɔ a wɔpaw
OEM / kokoam nkyerɛwde a wɔde kyekyere nneɛma
Akadeɛ
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